The Global Anisotropic Conductive Film Market refers to the market for a type of conductive adhesive film that enables vertical conduction and insulation in terminals. This film is used to connect substrates in camera modules and display panels and consists of fine conductive fillers such as metallic particles or metal-coated polymer balls and an adhesive resin. The market for anisotropic conductive film was valued at USD 480.90 million in 2019 and is expected to reach USD 762.25 million by 2027, growing at a CAGR of around 6% during the forecast period. The film is widely used in chip on film and chip on glass technologies.
Anisotropic conductive films are primarily used in the assembly of chips on RFID substrates. The consumer electronics sector has seen a significant increase in demand for flexible electronic displays, especially wearables, which has been advantageous for the growth of the anisotropic conductive film market. However, this film is known to have high temperature and moisture content, which may hinder the growth of the market during the forecast period.
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The report on the anisotropic conductive film market also discusses recent developments and technological advancements in the field. For instance, in 2018, a research team from the Korea Advanced Institute of Science and Technology (KAIST) successfully created a flexible vertical micro-LED (f-VLED) array using a precise alignment of an anisotropic conductive film bonding process. This development made it possible to transfer and interconnect the LEDs simultaneously, resulting in improved thermal reliability and lifespan by reducing the heat generated within the thin film LEDs. Such advancements in technology are likely to further boost the growth of the anisotropic conductive film market in the coming years.
Competitive Landscape:
a research team from integrated bioelectronics and materials and engineering in the U.S. published a study that discussed the fabrication of a disposable free-standing electrochemical sensing system (FESS). The FESS was designed to address the challenges associated with wearable biosensors and enable better integration in consumer electronics. The team engineered the FESS as a double-sided adhesive, vertically conductive, and flexible microfluidic bioanalytical thin-film system composed of numerous vertically stacked films, including an adhesive anisotropic conductive film. This innovative approach may lead to the development of more advanced and effective wearable biosensors that can be integrated seamlessly into consumer electronics.
some leading companies operating in the global Keyword market:
3M, Amada Miyachi America, Btechcorp, Dexerials Corporation, DELO Adhesives, Hitachi Chemicals, SunRay Scientific, Pixel Interconnect Inc., Loctite, and PVA TePla America.
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The global market is further segmented into type and application:
Product Outlook (Revenue in USD Million; 2017–2027)
- Acrylic-Based
- Epoxy Resin-Based
Technology Outlook (Revenue in USD Million; 2017–2027)
- Chip on Board
- Chip on Flex
- Chip on Glass
- Flex on Board
- Flex on Flex
- Flex on Glass
End-Use Outlook (Revenue in USD Million; 2017–2027)
- Aerospace
- Automotive
- Displays
- Electronic Components
- Others
Regional analysis provides insights into key trends and demands in each major country that can affect market growth in the region.
- North America (U.S., Canada, Mexico)
- Europe (Germany, U.K., Italy, France, BENELUX, Rest of Europe)
- Asia Pacific (China, India, Japan, South Korea, Rest of APAC)
- Latin America (Brazil, Rest of LATAM)
- Middle East Africa (Saudi Arabia, U.A.E., South Africa, Rest of MEA)
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